According to statistics from relevant departments, there are problems in the actual use of solid wood flooring, and more than 50% are caused by improper laying, and only 5% are due to the quality of the floor itself. It can be seen that whether the laying process is reasonable or not is the most important factor affecting the effect of the floor. Relevant experts remind owners to avoid the following wrong laying methods.
The ground is not level
Uneven ground will cause part of the floor and keel to hang in the air, making noise when stepped on.
Keel is not moisture-proof
The moisture content of undried wooden keel is usually about 25%, and the moisture content of qualified wooden floor is generally 12%. If the humidity is too high, the wooden floor will quickly absorb moisture, causing the floor to arch and the paint surface to burst.
Too loose or too tight
As the temperature and humidity of the environment change, wooden floors will expand or contract. Therefore, when laying the floor, the tightness of the wooden floor should be reasonably arranged according to the ambient temperature and humidity of the place of use. If it is too loose, the floor will shrink and there will be larger gaps, and if it is too tight, the floor will arch when it expands.
Fix with nails
In the construction, the fixing method of hammering wooden wedge and iron nail will cause insufficient nail-holding force due to the small contact surface between the wooden wedge and the iron nail, which can easily cause the wooden keel to loosen and make noise when stepping on the floor.
Engineering has crossover
During construction, the floor is laid first, and then other constructions are carried out on the floor. This is the usual practice of the current decoration team. But in this way, after the floor is laid, it often takes a month or even longer to polish and paint. During this period, no isolation measures were taken for the floor and the surrounding water vapor and chemicals, which may cause the wooden floor to deform and crack due to the rapid change in moisture content.
